Amber Enterprises India Limited on June 26 informed the exchanges about a press release announcing a strategic cooperation between Schweizer Electronic AG and IL JIN Electronics (India) Pvt Ltd in the printed circuit board segment. IL JIN Electronics is part of the Amber Group and the cooperation specifically involves Ascent Circuits, which operates the bare PCB business.
The planned cooperation combines Schweizer's long-standing experience in automotive and industrial PCB applications with Ascent Circuits' manufacturing footprint and expansion plans in India. This is expected to create additional value for customers in Europe and the US by strengthening supply-chain resilience and broadening sourcing options, while preparing a structured path toward future technology capabilities.
In the first phase, the partners will focus on selected standard automotive and industrial PCB applications based on existing manufacturing capabilities. In parallel, the cooperation will prepare a step-by-step roadmap toward more complex multilayer and HDI applications as Indian capacities become available.
A key element of the cooperation includes the alignment of customer requirements, technical capabilities, capacity needs and commercial competitiveness. High quality, qualification and process standards will play an important role in meeting the expectations of demanding automotive and industrial customers.
The partners also intend to evaluate selected future growth areas in other industries where the cooperation can create long-term customer value. The cooperation is aimed at building a scalable platform for future growth by combining the complementary strengths of both companies.
Disclaimer: This article is based on company filings submitted to the Bombay Stock Exchange (BSE) and National Stock Exchange of India (NSE) and is for informational purposes only. It does not constitute investment advice or a recommendation. Investors should conduct their own research and consult a qualified financial advisor before making investment decisions.